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BDP
BDP

Bisphenol A bis(diphenyl phosphate (BDP)

Chemical Name: Bisphenol-A bis(diphenyl phosphate) (BDP)
Cas No. : 5945-33-5
EINECS No.: 425-220-8
Molecular formula: (C₃₉H₃₄O₈P₂)
Molecular weight: 692.64

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Basic Properties

Chemical Classification

Organophosphorus compound (C₃₉H₃₄O₈P₂)

Solubility

Soluble in Aromatic hydrocarbons (toluene, xylene), Halogenated solvents (dichloromethane), Ethers (THF), Esters (ethyl acetate). Insoluble in: Water (<0.01 g/L at 20°C), Aliphatic hydrocarbons (hexane).

Functional Features

Primary Advantages

  • High-efficiency flame retardancy (UL94 V-0 achievable at 8–15 wt%)
  • Excellent thermal stability (decomposition onset >300°C)
  • Low volatility (vapor pressure <1×10⁻⁸ Pa at 25°C)

Secondary Benefits

  • Maintains polymer mechanical properties (vs. brominated alternatives)
  •  Good electrical insulation properties

Limitations

  • Requires anti-dripping agents (e.g., PTFE) for certain polymers
  • May affect transparency in clear resins

Flame Retardant Mechanism

Triple-Action Protection

 

  • Gas Phase: Releases PO· radicals to interrupt combustion chain reactions
  • Condensed Phase: Promotes char formation (up to 30% weight retention at 600°C)
  • Endothermic Decomposition: Absorbs 450–500 J/g during pyrolysis

Basic Specifications

No. Standards Index
1 Flashing Point(℃) 330-340
2 Viscosity (40℃),mPa·s 2200-2500
3 Freezing Point (℃) 4-5
4 Acidity (mgKOH/g)  <0.2
5 Moisture content % <0.1
6 Specific gravity (20℃) 1.250-1.270

Primary Applications

Engineering Plastics

 

Materials: PC/ABS, PPO-HIPS, PET/PBT blends

Processing

  • Optimal loading: 10–18 wt%
  • Processing temp: ≤280°C (short-term)

Performance

  • UL94 V-0 at 1.6mm thickness (PC/ABS)
    LOI improvement: +8–12 points

Electronics Encapsulation

 

Applications

  • LED packaging materials
  • Circuit board coatings

Benefits

  • Low corrosion risk vs. halogenated systems
  • CTI >400V

Transportation Materials

 

Compliance:

  • EU 2019/1021 (POPs regulation)
  • China GB/T 26572-2011

Formulation Tips

 Synergistic Systems

  • 3:1 ratio with melamine polyphosphate for enhanced charring
  • 1–2% silicone additives for improved dispersion

Processing Notes

  • Pre-dry polymers (<0.05% moisture) before compounding
  • Recommend twin-screw extrusion for optimal dispersion

Package

  • 200 kg stainless steel drums
    1,000 kg IBC totes (nitrogen blanketed)

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